Intellectual Property India Publishes Patent Application for 'Diamond-Based Polishing Compositions With Improved Silicon Carbide Removal Rate' Filed by Diamond Innovations, Inc.

MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202537091519 A) filed by Diamond Innovations, Inc., Worthington, U.S.A., on Sept. 24, for 'diamond-based polishing compositions with improved silicon carbide removal rate.'

Inventor(s) include Dumm, Tim; Moritz, Charles Erik; and Draskovic, Thomas.

The application for the patent was published on Oct. 31, under issue no. 44/2025.

According to the abstract released by the Intellectual Property India: "Provided is a polishing composition for polishing semiconductor wafer surfaces, including a surface-modified monocrystalline diamond with a D(50) particle size ranging from about 0.10 m to about 1 m; a vehicle selected from the group consisting of water-based vehicles, glycol-based vehicles, oil-based vehicles, and hydrocarbon-based vehicles; and optionally one or more additives. Further presented are associated methods for polishing semiconductor wafer surfaces."

The patent application was internationally filed on Mar. 28, 2024, under International application No.PCT/IB2024/053017.

Disclaimer: Curated by HT Syndication.