MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511122355 A) filed by K. R. Mangalam University, Gurugram, Haryana, on Dec. 5, 2025, for 'device for thermal-optimized power electronics packaging.'
Inventor(s) include Dr. Satinder Pal Singh; Dr. Swati Gupta; and Dr Dilraj Preet Kaur.
The application for the patent was published on Jan. 23, under issue no. 04/2026.
According to the abstract released by the Intellectual Property India: "The present invention relates to a device for thermal-optimized power electronics packaging designed to enhance heat dissipation, reduce thermal resistance, and improve reliability of semiconductor components operating under high power density and wide temperature variations. The device incorporates an engineered substrate, metallization layers, high-conductivity bonding interfaces, integrated heat-spreading structures, and optimized interconnect configurations to achieve uniform thermal distribution and reduced junction temperatures. A multi-layer thermal conduction architecture transfers heat efficiently from semiconductor junctions to external dissipation systems while maintaining structural stability during repetitive thermal cycling. The packaging integrates materials with compatible expansion characteristics, low-inductance electrical pathways, and optional embedded thermal monitoring elements to support high-frequency switching and advanced thermal control. The invention provides a scalable, manufacturable, and thermally superior packaging framework compatible with silicon, silicon carbide, gallium nitride, and emerging semiconductor technologies."
Disclaimer: Curated by HT Syndication.
