MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511123075 A) filed by K. R. Mangalam University, Gurugram, Haryana, on Dec. 6, 2025, for 'device for automated heat sink reconfiguration under variable thermal loads.'
Inventor(s) include Dr. Anshu; and Dr. Kaushal Kumar.
The application for the patent was published on Jan. 23, under issue no. 04/2026.
According to the abstract released by the Intellectual Property India: "The invention provides a device for automated heat-sink reconfiguration under variable thermal loads. The device incorporates a base thermal body, a distributed thermal-sensing network, a microcontroller module, and an actuation mechanism coupled to a reconfigurable fin assembly. Localized temperature data are continuously collected and analyzed to determine real-time and predicted heat-flux transitions. A prediction engine within the microcontroller employs thermal-state modeling to anticipate upcoming thermal demands. The actuation mechanism adjusts fin geometry, spacing, or orientation to optimize heat-dissipation pathways without user intervention. The system supports adaptive airflow management, enhanced conductive and convective heat transfer, and improved thermal stability across fluctuating load conditions. The invention enables intelligent, energy-efficient, and autonomous thermal management suitable for high-density electronics, power modules, and compact computing devices."
Disclaimer: Curated by HT Syndication.
