MUMBAI, India, April 17 -- Intellectual Property India has published a patent application (202517133735 A) filed by Caihong Display Devices Co. Ltd., Shaanxi, China, on Dec. 30, 2025, for 'device and method for improving reliability of thermocouple at channel cooling section during temperature rise stage.'
Inventor(s) include Wang, Menglong; Hou, Hongrong; Yang, Wei; Yu, Chao; and Luo, Ting.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "A device for improving the reliability of a thermocouple at a channel cooling section during a temperature rise stage. A notch (5) is provided on a thermocouple sheet (2), and a thermocouple (4) is provided in the notch (5) of a groove-shaped structure. The notch (5) is bent upwards, such that a partial cavity is formed between the inside thereof and a cooling tube body (1), and the structure of the cavity needs to be sufficient for flexible movement of a temperature measurement point, i.e., a welding joint (3) of the thermocouple (4). The root of the thermocouple (4), i.e., the temperature measurement point (3) of the welding thermocouple, is accurately arranged in the notch (5), thereby ensuring good contact between the temperature measurement point and a measured object, and improving the accuracy of temperature measurement. The sliding thermocouple structure solves the problem of large-area damage to thermocouples at the top during a temperature rise stage, thus improving the reliability of thermocouples. Also provided is a method for the reliability of a thermocouple at a channel cooling section during a temperature rise stage."
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