MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202541112419 A) filed by J. Thirupaavai; S. Amritha; B. Logesh; N. Sathasivam; and J. S. Sharadha Sree, Coimbatore, Tamil Nadu, on Nov. 17, 2025, for 'design and development of gluten free edible ink for structural 3d food printing.'
Inventor(s) include J. Thirupaavai; S. Amritha; B. Logesh; N. Sathasivam; and J. S. Sharadha Sree.
The application for the patent was published on Jan. 9, under issue no. 02/2026.
According to the abstract released by the Intellectual Property India: "The invention discloses a three-dimensional (30) printable edible ink composition compns1ng jackfruit seed flour, oat powder, honey, and butter, formulated for extrusion-based food printing. The composition utilizes jackfruit seed flour as a starch-protein base, oat powder for fiber enrichment, honey as a natural sweetener,binder and plasticizer, and butter for lubrication and texture enhancement. The process involves drying and milling jackfruit seeds, blending all ingredients, hydrating to obtain a homogeneous paste, extruding through a syringe-based 3D printer, and baking the printed structures. The ink exhibits desirable rheological properties, including shear-thinning behavior and yield stress, ensuring smooth extrusion and structural stability. The baked products retain geometric precision, nutritional richness, and sensory quality. This innovation valorizes agricultural waste into functional, sustainable, and customizable food materials suitable for digital food fabrication and personalized nutrition. Keywords: 3D food printing, jackfruit seed flour, edible ink, extrusion, sustainable food, personalized nutrition."
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