MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079360 A) filed by Towa Corporation, Kyoto, Japan, on Aug. 21, for 'cutting device, cutting method, and method for manufacturing cut product.'
Inventor(s) include Watanabe Hajime; Ishibashi Kanji; Kataoka Shoichi; Sakamoto Rin; and Horimoto Kyotaro.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "Provided are a cutting device, a cutting method, and a method for manufacturing a cut product, with which it is possible to perform accurate half-cuts with little variability. The cutting device according to the present invention comprises a table for holding an object to be cut, a cutting mechanism having a blade capable of cutting the object to be cut, a detecting unit for detecting contact between the blade and an upper surface of the object to be cut, and a control unit for controlling the cutting mechanism, wherein the control unit controls a height-direction position of the blade when cutting the object to be cut on the basis of a height position of the blade when the detecting unit detects contact between the blade and the upper surface of the object to be cut."
The patent application was internationally filed on Nov. 28, 2023, under International application No.PCT/JP2023/042457.
Disclaimer: Curated by HT Syndication.
