MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202441013533 A) filed by JAIN, Bangalore, Karnataka, on Feb. 24, 2024, for 'cutting assistive device for eatables.'
Inventor(s) include Dr. Rajasekar K.
The application for the patent was published on Aug. 29, under issue no. 35/2025.
According to the abstract released by the Intellectual Property India: "A cutting assistive device for eatables, comprises of a plate 1 configured with a pair of semi-circular shaped members 2 that allows a user to insert fingers in order to hold plate 1 on fingers, an artificial intelligence-based imaging unit 3 capturing images of eatable that user desires to cut for generating 3D (Three Dimensional) map of eatable, a computing unit accessed by user to input number of slices to be cut from eatable along with a type of slice that is required to be cut for actuating a holographic projection unit 4 for projecting a holographic image on eatable that assists user to place plate 1 on eatable and an ultrasonic sensor detecting placement of plate 1 on eatable for actuating a pair of telescopic pins 5 to apply force on a blade 6 attached with pins 5 to cut eatable into user specified number and type of slices."
Disclaimer: Curated by HT Syndication.
