MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517072381 A) filed by Sekisui Chemical Co. Ltd., Osaka, Japan, on July 30, for 'curable thermally conductive adhesive and thermally conductive member.'
Inventor(s) include Furukawa, Atsushi; Iwamoto, Tatsuya; Kobayashi, Yuusuke; and Yoshioka, Tetsurou.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "A curable thermally conductive adhesive containing a curable binder and a thermally conductive filler, wherein a cured product of the curable thermally conductive adhesive exhibits a reduction in mass of 1.5% or less after undergoing a temperature cycle test involving 20 cycles consisting of three hours at -40 C and three hours at 80 C, and exhibits an elastic modulus of 1.2X108 Pa or less at 80 C."
The patent application was internationally filed on Jan. 31, 2024, under International application No.PCT/JP2024/003184.
Disclaimer: Curated by HT Syndication.
