MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517072379 A) filed by Sekisui Chemical Co. Ltd., Osaka, Japan, on July 30, for 'curable thermally conductive adhesive, thermally conductive member, and battery assembly.'
Inventor(s) include Yoshioka, Tetsurou; Iwamoto, Tatsuya; Kobayashi, Yuusuke; Furukawa, Atsushi; Morimoto, Kohei; and Iino, Tatsuya.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "This curable thermally conductive adhesive contains a curable binder and a thermally conductive filler. A cured product of the curable thermally conductive adhesive has a tensile storage elastic modulus of 2.0 108 Pa or less and a tand value of 0.05-0.6, as measured at 10 Hz and 25 C using dynamic viscoelasticity measurements."
The patent application was internationally filed on Jan. 31, 2024, under International application No.PCT/JP2024/003182.
Disclaimer: Curated by HT Syndication.
