MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202547083291 A) filed by Threebond Co. Ltd., Tokyo, on Sept. 2, for 'curable resin composition.'
Inventor(s) include Watanabe, Yosuke.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "The present invention provides a curable resin composition that can be cured at room temperature without using a heat source or light source, and of which a cured material has excellent high compression resistance and sealing property. The curable resin composition according to the present invention contains the following (A) to (D) components: (A) component: A compound having 2 or more epoxy groups (B) component: A thiol curing agent (C) component: Resin hollow particles (D) component: A curing accelerator."
The patent application was internationally filed on Feb. 21, 2024, under International application No.PCT/JP2024/006342.
Disclaimer: Curated by HT Syndication.
