MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411012432 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Feb. 21, 2024, for 'crack repairing device.'
Inventor(s) include Gagandeep.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "A crack repairing device comprises of a platform 1 positioned over a fixed surface and arranged with multiple wheels 2 that maneuver platform 1, a pair of plates 3 accessed by a user to position a plank to be repaired within plates 3, an imaging unit 4 determines dimension of plank, multiple motorized hinge joints to provide movement to each section of plates 3 in view regulating plate's 3 shape, a suction unit 5 to affix plank with plates 3, an ultrasonic sensor to determine presence and dimension of a crack over plank that is to be repaired, a robotic arm 6 to position an electronic nozzle 7 over crack, a pair of vertical rods 8 assembled with a motorized sliding unit 9 that provides translation to multiple telescopic clamps 10 to arrange around lateral sides of plank, a pressure sensor for monitoring pressure applied by clamps 10 over plank."
Disclaimer: Curated by HT Syndication.
