MUMBAI, India, Oct. 24 -- Intellectual Property India has published a patent application (202347040656 A) filed by Saab Ab, Linkoping, Sweden, on June 14, 2023, for 'cooling system of an electronic module with a leakage control device.'
Inventor(s) include Blennius, Martin.
The application for the patent was published on Oct. 24, under issue no. 43/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure relates to a system (1) for controlling the cooling of an electronic module (2), the system (1) comprising an electronic module (2) extending in a first (x1) and a second direction (y1), a cooling pipe structure (3) and a leakage device (4). The cooling pipe structure (3) is arranged to transfer a flow of cooling medium, so to cool the electronic module (2), wherein the cooling pipe structure (3) further comprises a muzzle (5) extending outwardly from a circumferential portion (6) of said cooling pipe structure (3) and a coupling portion (7) being mated with an open end (8) of the muzzle (5) wherein said leakage device (4) comprises a leak collecting means (9) circumferentially enclosing a mating interface (10) of the muzzle (5) and the coupling portion (7), so to collect any leakage from the cooling pipe structure (3). The leakage device (4) further comprises a transporting portion (11) extending in-between the leak collecting means (9) and an analysis reservoir (12), so to lead any leakage collected in the leak collecting means (9) to said analysis reservoir (12)."
The patent application was internationally filed on Dec. 08, 2021, under International application No.PCT/SE2021/051219.
Disclaimer: Curated by HT Syndication.
