MUMBAI, India, Aug. 1 -- Intellectual Property India has published a patent application (202517060838 A) filed by Wieland-Werke Ag, Ulm, Germany, on June 25, for 'cooling system for the liquid immersion cooling of electronic components.'
Inventor(s) include Gotterbarm, Achim; Scheuss, Michael; Gaibler, Harald; Obst, Verena; and Hofmann, Philipp.
The application for the patent was published on Aug. 1, under issue no. 31/2025.
According to the abstract released by the Intellectual Property India: "The invention relates to a cooling system (1) for the liquid immersion cooling of electronic components (2), comprising: a container (3), the interior of which can be filled with a two-phase heat transfer fluid (4), into which electronic components (2) can be immersed in the liquid phase thereof, wherein the container (3) has a gas chamber (5) over the surface (41) of the liquid heat transfer fluid (4) and a lid (6) for closing the container (3) in a fluid-tight manner. The lid (6) or the container (3) has a seal device, comprising a face which faces the gas chamber (5), a face which faces away from the gas chamber (5), and a seal which prevents the passage of a gaseous fluid and which comprises a seal surface. Furthermore, at least the face facing the gas chamber (5) is designed to be continuous as a vapor barrier against the chemical effect of the fluid."
The patent application was internationally filed on Jan. 23, 2024, under International application No.PCT/EP2024/051465.
Disclaimer: Curated by HT Syndication.
