MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202431020454 A) filed by Dongwoo Hst Co. Ltd., Chungcheongnam, Republic of Korea, on March 19, 2024, for 'cooling device for heat treatment.'
Inventor(s) include Chung, Soo Jin; Chung, Won Ki; Park, Jun Yong; Shin, Young Min; and Lee, Hyeon Seung.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure relates to a cooling device for heat treatment that performs heat treatment by cooling individually or as a whole a heated metal object. The cooling device for heat treatment includes: a chamber to which a plurality of objects is charged through one open side thereof; an individual cooling unit configured to be provided in the chamber, to individually cover the object, and to spray a cooling medium onto the object; and a driving unit configured to be provided on the chamber and to move the individual cooling unit in an up and down direction. With this configuration, it is possible to obtain a required cooling capacity by cooling individually or as a whole a heated metal object."
Disclaimer: Curated by HT Syndication.
