MUMBAI, India, March 13 -- Intellectual Property India has published a patent application (202611007387 A) filed by Motorama Ev Private Limited, Noida, Uttar Pradesh, on Jan. 25, for 'cooling arrangement for an electronic assembly.'
Inventor(s) include Abhishek Gupta.
The application for the patent was published on March 13, under issue no. 11/2026.
According to the abstract released by the Intellectual Property India: "Disclosed is a cooling arrangement for an electronic assembly, comprising an electronic substrate comprising an upper surface on which at least one heat-generating electronic component is mounted and a lower surface opposite the upper surface, a cooling plate disposed adjacent to the lower surface of the electronic substrate, and a plurality of connecting points extending between the electronic substrate and the cooling plate, each connecting point connecting the electronic substrate to the cooling plate at a corresponding connection location on the cooling plate, wherein, at each connection location, the cooling plate comprises a first zone comprising a first set of perforations, a second zone comprising a second set of perforations, and a third zone disposed between the first zone and the second zone, the third zone comprising a third set of perforations extending parallel to a central axis of the corresponding connecting point."
Disclaimer: Curated by HT Syndication.
