MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517051409 A) filed by Robert Bosch Gmbh, Stuttgart, Germany, on May 28, for 'contact arrangement and electronics module.'
Inventor(s) include El Ouardi, Abdessamad; and Becsei, Balint.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "The invention proceeds from a contact arrangement comprising a circuit carrier, a plug-in connector and a positioning device which is designed to position the circuit carrier and the plug-in connector relative to each other in terms of their positional arrangement. This is done by way of the positioning device having at least two positioning elements which are designed so as to complement each other and together form an interlocking, frictional and/or integral connection and thus define the positional arrangement. Here, an interlocking, frictional and/or integral connection is then formed between in each case at least one positioning element formed on the plug-in connector and at least one positioning element formed in a complementary manner on the connecting element and/or formed between in each case at least one positioning element formed on the circuit carrier and at least one positioning element formed in a complementary manner on the connecting element. A closed EMC-proof shielding surface is additionally formed in the region of the positioning device, in particular a metal shielding surface, the projection surface of which that is obtained perpendicularly on a main side of the circuit carrier completely covering at least one similarly obtained projection surface of the positioning device."
The patent application was internationally filed on Nov. 28, 2023, under International application No.PCT/EP2023/083346.
Disclaimer: Curated by HT Syndication.
