MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202544023510 A) filed by Te Connectivity Solutions Gmbh, Schaffhausen, Switzerland, on March 17, for 'connector kit, manufacturing method for a connector kit, and connection method to a connector kit.'
Inventor(s) include Keil, Kevin.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a connector kit (100) for connecting a shielded high-voltage conductor to an aggregate, the connector kit (100) comprising: a power connector (120) for contacting a cable core (144) of the shielded high-voltage conductor to a mating connector of the aggregate in the plugging direction (S), a shield header (110) with a manufacturer-defined shield header contact (112, 114), wherein the shield header (110) forms a shield path at least in part between a shield conductor (142) of the shielded high-voltage conductor and a shield housing (1200) of the aggregate, and wherein the shield housing (1200) comprises a user-defined interface opening (1210) so that the mating connector is contactable to the power connector, a multifunctional adapter (300) with a user-defined aggregate connection section (312) for the electromechanical coupling to the shield housing (1200) of the aggregate and a manufacturer-defined shield header opening (320) extending perpendicular to the plugging direction (S) so that the power connector is contactable to the mating connector, wherein the multifunctional adapter (300) and the shield header contact (112) can be coupled to form a unit so that an adapter section (310) between the user-defined aggregate connection section (312) and the manufacturer-defined shield header opening (320) electrically closes the shield path between the shield housing (1200) of the aggregate and the shield conductor (142)."
Disclaimer: Curated by HT Syndication.
