Intellectual Property India Publishes Patent Application for 'Conductive Lines For Interconnection In Stacked Device Structures' Filed by Bae Systems Information And Electronic Systems Integration Inc.

MUMBAI, India, March 14 -- Intellectual Property India has published a patent application (202517131281 A) filed by Bae Systems Information And Electronic Systems Integration Inc., New Hampshire, U.S.A., on Dec. 24, 2025, for 'conductive lines for interconnection in stacked device structures.'

Inventor(s) include Wyckoff, Nathaniel P.; Terry, Benjamin; Warren, Alexander S; and Waggoner, Joseph.

The application for the patent was published on March 13, under issue no. 11/2026.

According to the abstract released by the Intellectual Property India: "A microelectronics device structure includes a device having (i) a lower surface, (ii) an upper surface opposite the lower surface, and (iii) a side surface extending between the lower surface and the upper surface. The integrated circuit structure further includes a conductive line having (i) a first section on the upper surface, (ii) a second section on the side surface, and (iii) a third section on the lower surface. In an example, the first section and the second section of the conductive line is a monolithic conductive structure, with no seam or interface between the first section and the second section. Additionally or alternatively, in an example, the second section and the third section of the conductive line is a monolithic conductive structure, with no seam or interface between the second section and the third section."

The patent application was internationally filed on May 29, 2024, under International application No.PCT/US2024/031393.

Disclaimer: Curated by HT Syndication.