MUMBAI, India, Jan. 2 -- Intellectual Property India has published a patent application (202541123039 A) filed by Vellore Institute Of Technology, Vellore, Tamil Nadu, on Dec. 5, 2025, for 'composite sandwich panels with gfrp laminate and 3d printed pla honeycomb core for thermal environments.'
Inventor(s) include Dr. Manoharan R; and Mr. Ajit Madhavrao Tigote.
The application for the patent was published on Jan. 2, under issue no. 01/2026.
According to the abstract released by the Intellectual Property India: "The present disclosure provides a composite sandwich panel system (300) comprising a first glass fiber reinforced polymer laminate layer (302) with glass fiber matrix (304) and resin system (306), a polylactic acid honeycomb core (308) with hexagonal cell structure (310) and bio-inspired geometry (312) positioned between laminate layers, a second glass fiber reinforced polymer laminate layer (314) with glass fiber matrix (316) and resin system (318), a thermal analysis module (320) processing thermal behavior data, a finite element processor (322) performing computational analysis of structural and thermal properties and interfacing with the thermal analysis module (320), a material property database (324) storing material characteristics accessed by the finite element processor (322), and an experimental validation system (326) connecting to the composite sandwich panel system (300) and thermal analysis module (320) providing empirical testing to verify analytical results."
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