MUMBAI, India, Nov. 7 -- Intellectual Property India has published a patent application (202547095958 A) filed by Dowa Metaltech Co. Ltd., Tokyo, on Oct. 6, for 'composite material, composite material production method, terminal, and terminal production method.'
Inventor(s) include Kiwaki Kodai; Sugawara Akira; Tomiya Takao; and Takahashi Hirotaka.
The application for the patent was published on Nov. 7, under issue no. 45/2025.
According to the abstract released by the Intellectual Property India: "Provided is a composite material in which a composite film that is composed of a silver layer containing metal sulfide particles is formed on a base material, wherein the value X obtained by dividing the arithmetic average roughness Ra of the composite film by the thickness (m) of the composite film is 0.14 or less."
The patent application was internationally filed on Mar. 11, 2024, under International application No.PCT/JP2024/009270.
Disclaimer: Curated by HT Syndication.