Intellectual Property India Publishes Patent Application for 'Complementary Die-To-Die Interface' Filed by Apple Inc.

MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202518074597 A) filed by Apple Inc., Cupertino, U.S.A., on Aug. 5, for 'complementary die-to-die interface.'

Inventor(s) include Kolor, Sergio; Davidov, Dany; Pilip, Mark; Leshem, Nir; and Zimet, Lior.

The application for the patent was published on Aug. 29, under issue no. 35/2025.

According to the abstract released by the Intellectual Property India: "A system includes a first instance and a second instance of an integrated circuit. The integrated circuits include respective external interfaces with a physical pin layout having transmit and receive pins for a particular 5 bus located in complementary positions relative to an axis of symmetry. The external interfaces of the first and second instances of the integrated circuit are positioned such that the transmit and receive pins for the given I/O signal on the first instance are aligned, respectively, with the receive and transmit pins for the given I/O signal on the second instance."

The patent application was internationally filed on Mar. 04, 2022, under International application No.PCT/US2022/018831.

Disclaimer: Curated by HT Syndication.