Intellectual Property India Publishes Patent Application for 'Communication Method And Apparatus, Chip, Chip Module, And Storage Medium' Filed by Honor Device Co. Ltd.

MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202637047386 A) filed by Honor Device Co. Ltd., Guangdong, China, on April 14, for 'communication method and apparatus, chip, chip module, and storage medium.'

Inventor(s) include Zhang, Mingzhu; and Shan, Baokun.

The application for the patent was published on April 17, under issue no. 16/2026.

According to the abstract released by the Intellectual Property India: "A communication method and apparatus, a chip, a chip module, and a storage medium. When a first timer times out, does not run or is not configured and there is no resource for a delay status report, a scheduling request is triggered, wherein one or more duration values of the first timer are smaller than the minimum value of one or more duration values of a second timer. By reasonably setting the duration of the first timer, the scheduling request can be reasonably triggered when there is no resource for the delay status report, and then the delay status report is sent in time."

The patent application was internationally filed on Sept. 23, 2023, under International application No.PCT/CN2023/120904.

Disclaimer: Curated by HT Syndication.