Intellectual Property India Publishes Patent Application for 'Communication Method And Apparatus, And Chip, Chip Module And Storage Medium' Filed by Honor Device Co. Ltd.

MUMBAI, India, April 20 -- Intellectual Property India has published a patent application (202637045431 A) filed by Honor Device Co. Ltd., Guangdong, China, on April 9, for 'communication method and apparatus, and chip, chip module and storage medium.'

Inventor(s) include Zhang, Mingzhu.

The application for the patent was published on April 17, under issue no. 16/2026.

According to the abstract released by the Intellectual Property India: "A communication method and apparatus, and a chip, a chip module and a storage medium. The method comprises: after a delay state report is triggered, determining whether a first condition or a second condition is met, so as to determine whether to cancel the triggered delay state report or to assemble or send the delay state report, so that the triggered delay state report can be rationally processed."

The patent application was internationally filed on Sept. 23, 2023, under International application No.PCT/CN2023/120905.

Disclaimer: Curated by HT Syndication.