MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202517092439 A) filed by Dai Nippon Printing Co. Ltd., Tokyo, on Sept. 26, for 'coil component, power transmission device, power reception device, power transmission system, and power transmission method.'

Inventor(s) include Okabe Masato.

The application for the patent was published on Oct. 10, under issue no. 41/2025.

According to the abstract released by the Intellectual Property India: "A coil component 10 according to an embodiment comprises: a first planar coil 11; a second planar coil 12 overlying the first planar coil 11 and not connected to the first planar coil 11; and a capacitor 70 which is connected to either the first planar coil 11 or the second planar coil 12, and forms, together with the first planar coil or the second planar coil 12 to which the capacitor 70 is connected, a resonance circuit. The thickness of the second planar coil 12 is 0.15 mm to 0.35 mm inclusive."

The patent application was internationally filed on Feb. 27, 2024, under International application No.PCT/JP2024/007129.

Disclaimer: Curated by HT Syndication.