MUMBAI, India, Jan. 23 -- Intellectual Property India has published a patent application (202511123154 A) filed by Dr. Abhishek Kumar; Pooja; and Dilbagh, Ambala, Haryana, on Dec. 6, 2025, for 'climate resilient fungal bioformulation for seed germination and method of preparation thereof.'
Inventor(s) include Shabnam; Dr. Abhishek Kumar; Dr. Sultan Singh; Pooja; Manpreet Singh; Dilbagh; Dr. Sonu Langaya; and Dr. Mohit Kamboj.
The application for the patent was published on Jan. 23, under issue no. 04/2026.
According to the abstract released by the Intellectual Property India: "The invention relates to a climate resilient seed bioformulation comprising a combination of local fungal species namely Trichoderma asperellum, Penicillium chrysogenum, and Aspergillus sydowii encapsulated within a biodegradable chitosan and glycerol matrix. The formulation improves seed germination, seedling vigor, and tolerance to heat, salinity, and drought stress. The invention further comprises a method of preparing the formulation, a method of enhancing seed performance, and a system for commercial scale seed coating. Certain embodiments demonstrate extended stability and significant improvement in germination and vigor under climate induced stress conditions."
Disclaimer: Curated by HT Syndication.
