MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517050388 A) filed by Besi Netherlands B. V., Duiven, Netherlands, on May 26, for 'cleaning unit for a mould for encapsulating electronic components, moulding system and method for encapsulating electronic components.'
Inventor(s) include Van Driel, Albertus Franciscus Gerardus.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "Cleaning unit (10) for a mould for encapsulating electronic components, with a back and forth moveable carriage (15); an elongated extraction space (13) perpendicular to the moveability of the carriage; elongated skirts (19) parallel to the elongated extraction space; and a suction opening (17) in the elongated extraction space; wherein an elongated skirt has two parallel protruding raised edges (20, 21) between which a shielded space (22) is located. Also provided is a moulding system including such a cleaning unit (10) as well as a method for encapsulating electronic components using such a moulding system."
The patent application was internationally filed on Nov. 09, 2023, under International application No.PCT/NL2023/050589.
Disclaimer: Curated by HT Syndication.
