MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517041699 A) filed by Encapsys, Llc, Appleton, U.S.A., on April 30, for 'charge modified chitosan cross-linked encapsulate.'
Inventor(s) include Feng, Linsheng; Bobnock, Robert Stanley; Bardsley, Travis Ian; Smets, Johan; Tahon, Cedric Marc; and Collu, Mattia.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "An improved polyurea and chitosan core-shell delivery particles encapsulating a benefit agent is described. Chitosan is pre-modified with a modifying compound which is cationic, anionic, or nonionic. Alternatively the modification is accomplished in situ. The modifying compound is selected from the group consisting of an epoxide, aldehyde, or an a, -unsaturated compound, and is reactive with free amine moieties of chitosan, covalently bonding through CN bonds with the amine moieties of the chitosan. The modifying compound can contain acidic, hydroxyl, and quaternary ammonium groups. The reaction product of the chitosan, the modifying compound along with an electrophile, preferably a polyisocyanate yields a microcapsule with charge, improved release characteristics, improved compatibility or enhanced degradation characteristics, such as in OECD test method 301B."
The patent application was internationally filed on Nov. 29, 2023, under International application No.PCT/US2023/081490.
Disclaimer: Curated by HT Syndication.
