Intellectual Property India Publishes Patent Application for 'Ceramic Electronic Component And Method For Manufacturing Same' Filed by Taiyo Yuden Co. Ltd.

MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202517090420 A) filed by Taiyo Yuden Co. Ltd., Tokyo, on Sept. 22, for 'ceramic electronic component and method for manufacturing same.'

Inventor(s) include Shirota, Ayumi.

The application for the patent was published on Oct. 10, under issue no. 41/2025.

According to the abstract released by the Intellectual Property India: "The present invention comprises: a laminated chip in which a first internal electrode layer and a second internal electrode layer that are mainly composed of Ni are alternately laminated with a dielectric layer interposed therebetween, the laminated chip being formed such that the first internal electrode layer and the second internal electrode layer are alternately led out to a first end surface and a second end surface; a first external electrode in which the main component of a contact layer in contact with the first end surface is Cu; and a second external electrode in which the main component of a contact layer in contact with the second end surface is Cu. The first internal electrode layer contains a low-melting-point metal having a melting point equal to or less than the melting point of Pb. The concentration of the low-melting-point metal is higher in the first internal electrode layer than in the second internal electrode layer. The width of a portion of the first internal electrode layer connected to the first external electrode in a direction orthogonal to the lamination direction is less than the width of a portion corresponding to the second internal electrode layer, and the width of a portion of the second internal electrode layer connected to the second external electrode in the direction orthogonal to the lamination direction is greater than the width of the portion of the first internal electrode layer connected to the first external electrode."

The patent application was internationally filed on Mar. 28, 2024, under International application No.PCT/JP2024/012713.

Disclaimer: Curated by HT Syndication.