MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517053810 A) filed by Advanced Micro Devices, Inc; and Ati Technologies Ulc, Santa Clara, U.S.A., on June 3, for 'bounding volume hierarchy leaf node compression.'
Inventor(s) include Pankratz, David William John; Oldcorn, David Ronald; Skinner, Daniel James; Livesley, Michael John; and Mcallister, David Kirk.
The application for the patent was published on Aug. 22, under issue no. 34/2025.
According to the abstract released by the Intellectual Property India: "A technique for performing ray tracing operations is provided. The technique includes identifying triangles to include in a compressed triangle block; storing data common to the identified triangles as common data of the compressed triangle block; and storing data unique to the identified triangles as unique data of the compressed triangle block."
The patent application was internationally filed on Nov. 28, 2023, under International application No.PCT/US2023/081422.
Disclaimer: Curated by HT Syndication.
