MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202517079713 A) filed by Nippon Steel Corporation, Tokyo, on Aug. 22, for 'bonded/joined structure.'
Inventor(s) include Hasegawa, Masumi; Mitsunobu, Takuya; and Ueno, Shin.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "[Problem] To provide a bonded/joined structure which exhibits more excellent bonding durability, while maintaining red rust resistance. [Solution] A bonded/joined structure according to the present invention comprises a first member, a second member and an adhesive layer that joins the first member and the second member to each other. The first member is a plated steel member which has a steel member and a plating layer that has a specific chemical composition. With respect to the surface structure of the plating layer, the average area ratio of a-precipitated ? phases that are metal structures in which a-phases are precipitated in a ? matrix is 5% to 95%. When a cross-section obtained by cutting the bonded/joined structure in the stacking direction of the first member, the second member and the adhesive layer is observed with an electronic microscope, if L is the total bonding length with which the plating layer or the steel member is in contact with the adhesive layer, and L0 is the length of the observation field of view in a direction that is perpendicular to the normal direction of the surface of the steel member, the ratio L/L0 is 1.10 or more."
The patent application was internationally filed on Feb. 09, 2024, under International application No.PCT/JP2024/004675.
Disclaimer: Curated by HT Syndication.
