MUMBAI, India, June 27 -- Intellectual Property India has published a patent application (202517055395 A) filed by Saga Computer Numerical Control Co. Ltd., Anhui, China, on June 9, for 'board creasing and cutting device and method for packaging box production.'
Inventor(s) include Chen, Hong.
The application for the patent was published on June 27, under issue no. 26/2025.
According to the abstract released by the Intellectual Property India: "A board creasing and cutting device and method for packaging box production, the device comprising: a packaging box board (10); a housing (1); a feeding mechanism (9); a scanning assembly (28); an identification mechanism (8), which is used for identifying side lines and identification point positions of the conveyed packaging box board (10); a conveying mechanism (3); a moving mechanism (5); back point scanning assemblies (11), which are arranged at the bottom end of the moving mechanism (5), and are driven by the moving mechanism (5) to move, so as to identify the side lines of the packaging box board (10); a controller (12), which determines a creasing and cutting path of the packaging box board (10) by means of the scanning assembly (28), the identification mechanism (8) and the back point scanning assemblies (11); a main working platform (4); and an execution mechanism (7). In the device, a pattern of the packaging box board (10) can be mirrored on the back face of the packaging box board (10) by means of two instances of identification, so as to subsequently directly perform creasing and cutting without the help of a flipping device, such that the whole creasing and cutting device has a simpler structure and higher machining efficiency."
The patent application was internationally filed on June 20, 2023, under International application No.PCT/CN2023/101409.
Disclaimer: Curated by HT Syndication.
