MUMBAI, India, Aug. 8 -- Intellectual Property India has published a patent application (202441007248 A) filed by Jain, Bangalore, Karnataka, on Feb. 2, 2024, for 'automatic workpiece bending device.'
Inventor(s) include Sukumar R.
The application for the patent was published on Aug. 8, under issue no. 32/2025.
According to the abstract released by the Intellectual Property India: "An automatic workpiece bending device encompassing a platform 1 developed to be positioned on a ground surface, multiple suction cups 2 are arranged underneath the platform 1 for affixing the platform 1 with the surface, a hydraulic press 3 embedded on the platform 1 and is accessed by a user to positions a workpiece in between the press 3, a pair of telescopically operated clamping units 4 mounted on the platform 1 for securing the workpiece, a touch interactive display panel 5 mounted on the platform 1 for enabling the user to specify a pattern to which the workpiece is to be shaped, an artificial intelligence-based imaging unit 6 mounted on the body for monitoring precise bending of the workpiece, a laser cutting unit 7 embedded on the platform 1 for cuttings the workpiece in order to achieve the user-specified shape in an effective manner."
Disclaimer: Curated by HT Syndication.
