MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202411018898 A) filed by Sanskriti University, Mathura, Uttar Pradesh, on March 14, 2024, for 'automated wire joining device.'
Inventor(s) include Dr. Ramakant Upadhyay.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "An automated wire joining device, comprises a body 1 having two portions and attached with a handle, a touch sensor accessed by user to feed command for opening of body 1 via a hinge, a weight sensor installed on slot 7 detects placement of wires, multiple clamps 6 arranged on slot 7 grip wires, a first chamber 8 and second chamber 9 arranged inside first portion 2 for storing inflammable agent and alloy, an imaging unit 10 determines size of junction of wires, a first iris lid 11 arranged inside chambers 8, 9 dispenses agent and alloy inside a container 13, pair of electrodes 12 arranged inside container 13 generates spark inside container 13, a second iris lid 14 arranged inside container 13 dispenses molten alloy, a robotic link 15 arranged inside second portion 3 for hammering dispensed alloy via using a hammer 16 in order to solidify connected wires."
Disclaimer: Curated by HT Syndication.
