MUMBAI, India, Sept. 26 -- Intellectual Property India has published a patent application (202411019161 A) filed by Teerthanker Mahaveer University, Moradabad, Uttar Pradesh, on March 15, 2024, for 'automated wire bundle wrapping device.'
Inventor(s) include Manish Joshi.
The application for the patent was published on Sept. 26, under issue no. 39/2025.
According to the abstract released by the Intellectual Property India: "An automated wire bundle wrapping device, comprising a frame having a platform 1 to be positioned on a fixed surface crafted with a slot 2 for accommodating a wire bundle for wrapping, an artificial intelligence-based imaging unit 3 installed on the platform 1 for capturing multiple images of the platform 1, multiple motorized sliding units 4 installed on platform 1 for translating motorized roller 5 integrated on each sliding units, a vertical support 6 arranged on platform 1 for supporting a semi-circular member 7 on platform 1, a motorized circular slider 8 is arranged in between the support and member, a roll 9 coiled with a tape 10 assembled on member for wrapping tape 10 around bundle, a robotic arm 11 integrated with a cutter 12 to get deployed for cutting tape, an ultrasonic sensor integrated on frame for ensuring that the bundle is completely wrapped."
Disclaimer: Curated by HT Syndication.
