MUMBAI, India, April 17 -- Intellectual Property India has published a patent application (202621013445 A) filed by Gokul Global University, Patan, Gujarat, on Feb. 7, for 'automated sponge clay shaping device.'
Inventor(s) include Yagna B. Adhyaru.
The application for the patent was published on April 17, under issue no. 16/2026.
According to the abstract released by the Intellectual Property India: "An automated sponge clay shaping device comprising a platform 101 for supporting clay, an input means to enable a user to provide input commands regarding initiation of shaping, drying, and finishing operations of sponge clay, a clay conditioning unit with embedded heating element 104 s, temperature and moisture sensors, and electronic sprayers to maintain optimal softness and hydration, an imaging unit 105 captures and processes clay dimensions, alignment, and surface contours, transmitting data to a microcontroller, the microcontroller guides a robotic gripper 106 to retrieve shaping tools and position them over a clamp 108 via a telescopic link, the clamp 108, equipped with force and pressure sensors, dynamically adjusts gripping strength, while a motorized ball-and-socket joint provides multi-directional movement for controlled pressing, molding, and contouring, a speaker provides audible notifications, and a communication module enables wireless remote monitoring and control."
Disclaimer: Curated by HT Syndication.
