MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411012987 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Feb. 22, 2024, for 'automated soil ripping device.'
Inventor(s) include Gurpreet Singh.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "An automated soil ripping device, comprising a telescopically operated frame 1 attached with a handle 4 gripped by user to position two C-shaped members 5 on surface and distance between member 5 and surface is detected by a proximity sensor, multiple hinge joints tilt multiple T-shaped pneumatic pins 7 towards surface and pins 7 extends to penetrate into surface which is detected by a force sensor installed on each of pins 7 and after that hinge joints orient pins 7 in reverse direction to rip soil from surface, a tactile sensor mapped on members 5 detects hardness of surface, a hydraulic operated pusher 8 arranged between pins 7 and strip 6 for providing assistance to penetrate inside surface, an artificial intelligence-based imaging unit 9 determines presence of debris on pins 7 and if detected then a robotic gripper 10 collected them in a container 11 mapped on frame 1."
Disclaimer: Curated by HT Syndication.
