MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202411020129 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on March 18, 2024, for 'automated pavement layering device.'
Inventor(s) include Mitun Chakraborty.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "An automated pavement layering device, comprising a body 1 installed with an artificial intelligence-based imaging unit 2 which generates a 3-dimensional mapping of surroundings that is displayed on a touch interactive display panel 3 for enabling a user to select a portion that is to be layered, plurality of motorized wheels 4 move body 1 over surface, two telescopically operated rods 5 extend/retract for positioning a rectangular structure near evaluated point, a LiDAR sensor determines dimensions of portion, multiple plates 8 are configured in a structure and deployed by a motorized sliding unit 9, a meshed flap 10 is operated by a motorized hinge joint in synchronization with a vibrating unit for sieving collected soil for removing debris/stones from soil, a robotic arm layers paver brick on levelled soil, and a robotic link 11 does thumping on paver bricks by a metallic slab 12."
Disclaimer: Curated by HT Syndication.
