MUMBAI, India, Aug. 29 -- Intellectual Property India has published a patent application (202441013550 A) filed by JAIN, Bangalore, Karnataka, on Feb. 24, 2024, for 'automated expansion gap sealing device.'
Inventor(s) include Deepanshu Singh Satwaliya.
The application for the patent was published on Aug. 29, under issue no. 35/2025.
According to the abstract released by the Intellectual Property India: "An automated expansion gap sealing device, comprising a cuboidal body 1 provides support to body 1 on a ground surface, a laser sensor detecting presence of expansion gap on surface for providing movement to body 1 towards detected gap, an artificial intelligence-based imaging unit 4 determines presence of any debris inside gap and accordingly microcontroller actuates a vacuum based cleaning unit 5 for cleaning detected debris, a motorized roller 6 rotate on its axis to unwind a sheet pre-wrapped around roller 6 for actuating a motorized clipping unit 7 for deploying sheet over gap, an ultrasonic sensor detecting covering of gap with sheet for actuating a motorized cutter 8 for cutting sheet and a pair of electronic nozzle 9 connected with a reservoir 10 dispensing rubberized paste inside gaps."
Disclaimer: Curated by HT Syndication.
