MUMBAI, India, Oct. 31 -- Intellectual Property India has published a patent application (202411024021 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on March 26, 2024, for 'automated corn peeling device.'
Inventor(s) include Tek.
The application for the patent was published on Oct. 31, under issue no. 44/2025.
According to the abstract released by the Intellectual Property India: "An automated corn peeling device, comprising a wearable component 1 developed to be worn by a user while peeling a corn, an artificial intelligence-based imaging unit 2 installed on the component 1 for capturing multiple images in vicinity of the component 1 to detect the position of leafy portion of the corn, plurality of motorized grippers 3 arranged on inner portion of the component 1 for acquiring a grip over leafy portion of the corn, a moisture sensor integrated on the grippers 3 for monitoring moisture level of the leafy portion, an ultrasonic sensor integrated on the component 1 for monitoring presence of fibrous strings on the corn, plurality of extendable bars 4 are arranged on the component 1 for positioning a cutter 5 integrated on the bars 4 at base of the fibrous strings to remove the strings from the corn to complete peel the corn."
Disclaimer: Curated by HT Syndication.
