MUMBAI, India, Aug. 8 -- Intellectual Property India has published a patent application (202441007483 A) filed by Jain, Bangalore, Karnataka, on Feb. 3, 2024, for 'automated board cutting device.'
Inventor(s) include Dr. Rajasekar K.
The application for the patent was published on Aug. 8, under issue no. 32/2025.
According to the abstract released by the Intellectual Property India: "An automated board cutting device comprises of a platform 1 developed to be installed over a ground surface, a display panel 2 accessed by a user for providing input, a pair of clamping units 3 assembled with a pair of motorized sliding units 4 accessed by user for positioning a board which is to be cut, an imaging unit 5 for capturing multiple surrounding images, an inverted U-shaped frame 6 attached with a pair of telescopically operated L-shaped rods 7 that extends/retracts for positioning frame 6 over board, a grinding blade 8 for performing cutting of board, a slidable plank 9 for getting translated along length of frame 6 for ensuring cutting is performed as per evaluated pattern in order to obtain user-desired cut piece from board."
Disclaimer: Curated by HT Syndication.
