MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202441012500 A) filed by JAIN, Bangalore, Karnataka, on Feb. 21, 2024, for 'automated bamboo cutting device.'
Inventor(s) include Dr. Aditya Pai H.
The application for the patent was published on Sept. 5, under issue no. 36/2025.
According to the abstract released by the Intellectual Property India: "An automated bamboo cutting device, comprising a platform 1 attached with plurality of suction cups 2 for affixing the platform 1 on ground surface, an image capturing module 3 installed on the platform 1 determining a bamboo position, a telescopic gripping unit 4 installed on the platform 1 gripping the bamboo, an L-shaped mounting unit 5 installed on the platform 1 attached with a motorized iris lid 6 configured for securing the bamboo, a sliding unit 7 installed with a circular shaped cutter 8 attached with the platform 1 for cutting the bamboo and a lead screw arrangement 9 installed in between the mounting unit 5 and platform 1 for pushing the mounting unit 5 towards the cutter 8 for cutting the bamboo appropriately."
Disclaimer: Curated by HT Syndication.
