MUMBAI, India, Sept. 12 -- Intellectual Property India has published a patent application (202411012910 A) filed by Chandigarh University; and Chandigarh University Technology Business Incubator, Mohali, Punjab, on Feb. 22, 2024, for 'assistive device for removing maize kernels.'
Inventor(s) include Amandeep Singh.
The application for the patent was published on Sept. 12, under issue no. 37/2025.
According to the abstract released by the Intellectual Property India: "An assistive device for removing maize kernels, comprising a platform 1 attached with a C-shaped clamping unit 3 mounted on the platform 1 for securing a maize placed over the clamping unit 3 as detected by a weight sensor embedded on the platform 1, a cutting arrangement 4 configured with a circular opening 5 mounted on the platform 1 and positioned in continuation of the clamping unit 3, a laser measurement sensor detects dimension of maize, and accordingly an expandable pulley arrangement 4 integrated within the opening 5 accommodates maize and followed by which cutting arrangement 4 removes kernels in an effective manner, removed kernels is transferred in a storage box 6 via a cavity integrated within cutting arrangement 4, an artificial intelligence-based imaging unit 7 installed on platform 1 which detects any defective kernel and accordingly direct arrangement 4 to leave defective kernels on the maize."
Disclaimer: Curated by HT Syndication.
