MUMBAI, India, Jan. 9 -- Intellectual Property India has published a patent application (202521117623 A) filed by Sardar Vallabhbhai National Institute Of Technology, Surat, Gujarat, on Nov. 26, 2025, for 'apparatus for thermal management of electronic devices.'
Inventor(s) include Yarramsetty, Naresh; and Kumar, Bikash.
The application for the patent was published on Jan. 9, under issue no. 02/2026.
According to the abstract released by the Intellectual Property India: "Embodiments of the present disclosure relate to an apparatus (100) for thermal management of electronic devices. The apparatus (100) enables effective heat dissipation in electronic devices using a finned heat pipe (102), a Phase Change Material (PCM), and a finned heat sink assembly (106). The apparatus (100) utilizes the aluminium heat sink assembly (106) with one or more internal fins to conduct and distribute heat uniformly from a heater (108), which simulates an electronic heat source. The PCM absorbs thermal energy during operation, storing it as latent heat while maintaining a nearly constant temperature to prevent thermal spikes. The finned heat pipe (102) transfers a portion of this heat from an evaporator section to a condenser section, where one or more longitudinal fins enhances convective cooling to the surrounding air. This dual-path mechanism of latent heat absorption and vapor-phase heat transport ensures efficient energy discharge."
Disclaimer: Curated by HT Syndication.
