MUMBAI, India, May 29 -- Intellectual Property India has published a patent application (202611052914 A) filed by Noida Institute Of Engineering & Technology, Greater Noida, Uttar Pradesh, on April 25, for 'an integrated cooling channel structure for molds.'
Inventor(s) include Dr. Rajeev Kumar; and Ajeet Singh.
The application for the patent was published on May 29, under issue no. 22/2026.
According to the abstract released by the Intellectual Property India: "An integrated cooling channel structure for a mold includes a mold body, a cavity insert region, a core insert region, an inlet manifold, a primary cooling loop, secondary branch channels, balancing segments, sensor locations, reinforcement bridges, and an outlet manifold. The primary cooling loop provides base thermal regulation around the molding contour, while the branch channels target localized hot spots. Controlled flow distribution improves thermal uniformity, stabilizes cooling cycles, preserves mold strength, and enhances dimensional consistency of molded articles."
Disclaimer: Curated by HT Syndication.
