MUMBAI, India, May 1 -- Intellectual Property India has published a patent application (202641049549 A) filed by J. B. Institute Of Engineering And Technology, Hyderabad, Telangana, on April 18, for 'an ai-driven intelligent system for integrated structural and thermal behavior modeling of advanced materials.'
Inventor(s) include Dr. K. Venkatesham; Mr. Venkat Reddy Julakanti; Ms. K. Vaishnavi; Ms. B. Poojitha; Mrs. S. Swetha; and Mr. M. Naveen Kumar.
The application for the patent was published on May 1, under issue no. 18/2026.
According to the abstract released by the Intellectual Property India: "The present invention discloses an AI-driven intelligent system for integrated modeling and predictive analysis of structural and thermal behavior of materials under varying operational and environmental conditions. The system comprises a data acquisition module, preprocessing unit, multi-physics modeling engine, artificial intelligence prediction core, adaptive feedback mechanism, optimization module, and output visualization interface configured within a unified architecture. The invention enables simultaneous simulation of structural and thermal phenomena by establishing interdependent relationships between stress-strain dynamics and heat transfer mechanisms. Further, the integration of machine learning algorithms enhances predictive accuracy while significantly reducing computational time compared to conventional methods. The system supports real-time data integration, adaptive learning, and multi-objective optimization for efficient material design and performance evaluation. The proposed invention is applicable across multiple industrial domains including aerospace, automotive, construction, and electronics, thereby providing a scalable and efficient solution for next-generation material modeling and analysis."
Disclaimer: Curated by HT Syndication.
