MUMBAI, India, Jan. 2 -- Intellectual Property India has published a patent application (202541122663 A) filed by Malla Reddy (MR) Deemed to be University; Malla Reddy Engineering College For Womens; Malla Reddy University; Malla Reddy Vishwavidyapeeth; Malla Reddy College Of Engineering And Technology; and Dr. A. Pradeep Kumar, Medchal-Malkajgiri, Telangana, on Dec. 5, 2025, for 'ai-enhanced vlsi layout engine for thermal-aware optimization.'
Inventor(s) include Dr. A. Pradeep Kumar; Mr. K. Shiva Krishna; Dr. B. Nageshwar Rao; Dr. Y. Venkateshwara Reddy; Dr. Joyson; Dr Chitukuri Laxmikanth Reddy; Dr P Joel Josephson; and K. Uma Rani.
The application for the patent was published on Jan. 2, under issue no. 01/2026.
According to the abstract released by the Intellectual Property India: "The invention proposes a VLSI layout engine that is an automated algorithm based on AI-driven analysis, which reduces thermal hotspots when designing chips. The system analyses placement, routing, and power distribution dynamically with regard to reducing heat concentration and a uniform temperature spread across the die to assist the layout process. It uses machine-learning prediction models with rule-based optimization to produce layouts that are thermal as well as design-rule-compliant layouts. The engine keeps checking of switching activity, density of paths and power draw which before the fabrication suggests layout changes. This saves the redesign cycles and improves lifecycle and reliability of integrated circuits."
Disclaimer: Curated by HT Syndication.
