MUMBAI, India, Sept. 5 -- Intellectual Property India has published a patent application (202347060865 A) filed by Teraoka Seisakusho Co. Ltd., Tokyo, on Sept. 11, 2023, for 'adhesive sheet.'
Inventor(s) include Ogino, Shohei; Ishikawa, Kazuki; Iwakami, Yuuki; and Tsuchiya, Yasushi.
The application for the patent was published on Sept. 5, under issue no. 36/2025.
According to the abstract released by the Intellectual Property India: "Disclosed is an adhesive sheet having an adhesive layer (A1L) that is solid at 18 C, wherein the adhesive layer (A1L) includes an epoxy resin, the adhesive sheet has a pressure-sensitive adhesive region (A2R) formed by partially providing a pressure-sensitive adhesive (A2) on at least one surface of the adhesive layer (A1L), and the region where the pressure-sensitive adhesive region (A2R) is not formed on the surface is an adhesive layer exposed region (A1LR) in which the surface of the adhesive layer (A1L) is exposed. This adhesive sheet has an excellent temporary fixing property when adhered (characteristic showing adherence necessary for temporary fixation) and adhesive force after heat curing."
The patent application was internationally filed on Feb. 19, 2021, under International application No.PCT/JP2021/006368.
Disclaimer: Curated by HT Syndication.
