MUMBAI, India, Oct. 11 -- Intellectual Property India has published a patent application (202517090271 A) filed by Samsung Electronics Co. Ltd., Gyeonggi, Republic of Korea, on Sept. 22, for 'adhesive member and electronic device comprising same.'
Inventor(s) include Lim, Junyub; Song, Taehyun; Kim, Myunggon; Kim, Seohyun; and Jung, Jeamoon.
The application for the patent was published on Oct. 10, under issue no. 41/2025.
According to the abstract released by the Intellectual Property India: "The present disclosure relates to an electronic device. The electronic device according to one embodiment of the present disclosure comprises: a housing including a support member; a cover of which at least a portion is arranged to face the support member, and which extends toward the edge of the support member; and an adhesive member which is arranged between the support member and the cover and which has a first region and a second region extending from the first region toward the edge of the support member, wherein the adhesive member includes: a pressure sensitive adhesive layer having a first pressure sensitive adhesive layer coupled to the support member, and a second pressure sensitive adhesive layer spaced apart from the first pressure sensitive adhesive layer and coupled to the cover; and a base material layer arranged between the first pressure sensitive adhesive layer and the second pressure sensitive adhesive layer, and, in the first pressure sensitive adhesive layer and/or the second pressure sensitive adhesive layer, the second region is thicker than the first region."
The patent application was internationally filed on Jan. 24, 2024, under International application No.PCT/KR2024/001101.
Disclaimer: Curated by HT Syndication.
