MUMBAI, India, Nov. 21 -- Intellectual Property India has published a patent application (202517099030 A) filed by Soken Chemical & Engineering Co. Ltd., Tokyo, on Oct. 14, for 'adhesive composition and method for manufacturing adhesive layer.'
Inventor(s) include Takizawa Youichi.
The application for the patent was published on Nov. 21, under issue no. 47/2025.
According to the abstract released by the Intellectual Property India: "The present invention relates to a pressure-sensitive adhesive composition comprising a (meth)acrylic polymer and an organic solvent, wherein the organic solvent includes an alcohol-based organic solvent and the solid concentration is 50 mass% or higher. The present invention also relates to a method for producing a pressure-sensitive adhesive layer, the method comprising: a step in which the pressure-sensitive adhesive composition is applied to an object to be coated, thereby forming a layer of the pressure-sensitive adhesive composition; and a step in which the layer of the pressure-sensitive adhesive composition is dried, thereby forming a pressure-sensitive adhesive layer. When the pressure-sensitive adhesive layer has a thickness of 25 m, the haze of the pressure-sensitive adhesive layer is less than 5%."
The patent application was internationally filed on Mar. 07, 2024, under International application No.PCT/JP2024/008756.
Disclaimer: Curated by HT Syndication.
