MUMBAI, India, June 13 -- Intellectual Property India has published a patent application (202517052886 A) filed by Dic Corporation, Tokyo, on May 30, for 'adhesive composition, multilayer body and packaging material.'
Inventor(s) include Okada Katsuhiko; Kimura Ryouji; Takeda Miho; Watanabe Toshio; Wakahara Keisuke; Yamamoto Shinya; and Okino Kouhei.
The application for the patent was published on June 13, under issue no. 24/2025.
According to the abstract released by the Intellectual Property India: "Disclosed are: an adhesive composition which is composed of a fat or oil (A) having an acid anhydride group and a curing agent (H), wherein the curing agent (H) contains an acid-modified polyol (B) and an amine compound (C); a multilayer body which is obtained by sequentially stacking a first base material, an adhesive layer and a second base material in this order, wherein the adhesive layer is formed of the above-described adhesive composition; and a packaging material. It is preferable that: the fat or oil (A) having an acid anhydride group is a maleic acid anhydride-modified vegetable oil (A1); the acid-modified polyol (B) is an acid-modified polyester polyol; and the amine compound (C) contains a tertiary amine-containing polyol."
The patent application was internationally filed on Nov. 30, 2023, under International application No.PCT/JP2023/042853.
Disclaimer: Curated by HT Syndication.
